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ADE08S04 - TE Connectivity

Description: DIP Switches / SIP Switches SWITCH DIP SPST EXT ACT 8POS SMD

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PCB Footprints
ADE08S04 - TE Connectivity PCB footprint - Other - Other - ADE08S04-1
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ADE08S04 - TE Connectivity  - 3D model - Other - ADE08S04-1
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ADE08S04 Details

  • Manufacturer Part Number:

    ADE08S04

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.50.90.65

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    6.8

  • Actuator Color:

    WHITE

  • Actuator Length:

    0.039 inch

  • Actuator Material:

    POLYAMIDE6T

  • Actuator Type:

    SLIDE TYPE

  • Additional Feature:

    APPROVAL: UL

  • Body Breadth:

    7.5 mm

  • Body Color:

    BLACK

  • Body Height:

    3.5 mm

  • Body Length or Diameter:

    22.3 mm

  • Center Contact Material:

    COPPER ALLOY

  • Center Contact Plating:

    GOLD OVER NICKEL

  • Contact Current(AC)-Max:

    1 A

  • Contact Current(DC)-Max:

    0.1 A

  • Contact (DC) Max Rating R Load:

    0.1A@24VDC

  • Contact Function:

    OFF-ON

  • Contact Resistance:

    0.1 mΩ

  • Contact Voltage(DC)-Max:

    24 V

  • Dielectric Withstand Volts:

    300VAC V

  • Electrical Life:

    1000 Cycle(s)

  • End Contact Material:

    COPPER ALLOY

  • End Contact Plating:

    GOLD OVER NICKEL

  • Housing Material:

    POLYPHENYLENE SULPHIDE

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Material:

    POLYPHENYLENE SULPHIDE

  • JESD-609 Code:

    e4

  • Mounting Feature:

    PANEL MOUNT

  • Number of Positions:

    8

  • Number of Switch Sections:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Packing Method:

    TUBE

  • Surface Mount:

    NO

  • Switch Action:

    LATCHED

  • Switch Function:

    SPST

  • Switch Type:

    SLIDE DIP SWITCH

  • Terminal Finish:

    Gold (Au)

  • Terminal Material:

    COPPER ALLOY

  • Termination Type:

    SOLDER

ADE08S04 Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application notes or design guides. It's essential to follow these guidelines to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • To prevent whisker growth and ensure reliable connections, it's crucial to follow proper soldering and assembly techniques, such as using a nitrogen reflow oven and controlling the soldering temperature and time. Additionally, using a conformal coating can help prevent moisture ingress and whisker growth.
  • While the datasheet provides a recommended operating temperature range, it's essential to note that the maximum operating temperature range may be affected by factors such as power dissipation, thermal management, and environmental conditions. It's recommended to consult with TE Connectivity's application engineers or technical support for specific guidance.
  • The ADE08S04 is designed to meet specific mechanical and environmental requirements. However, if you plan to use it in a high-vibration or high-shock environment, you should consult with TE Connectivity's application engineers or technical support to ensure the component can withstand the expected mechanical stresses.
  • Yes, it's essential to follow proper storage and handling procedures to prevent damage to the component. This includes storing the components in their original packaging, avoiding exposure to moisture and extreme temperatures, and handling the components by the body rather than the leads.

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ADE08S04 Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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