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ADE7854ACPZ-RL - Analog Devices

Description: Polyphase Multifunction Energy Metering IC

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PCB Footprints
ADE7854ACPZ-RL - Analog Devices PCB footprint - Other - Other - QFN50P600X600X80-41N
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3D Models
ADE7854ACPZ-RL - Analog Devices  - 3D model - Other - QFN50P600X600X80-41N
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ADE7854ACPZ-RL Details

  • Manufacturer Part Number:

    ADE7854ACPZ-RL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    QFN

  • Package Description:

    6 X 6 MM, ROHS COMPLIANT, MO-220WJJD, LFCSP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    CP-40-10

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    24.5 mA

  • Supply Voltage-Max (Vsup):

    3.7 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

ADE7854ACPZ-RL Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the ADE7854ACPZ-RL. It's recommended to follow a star-ground configuration, keep analog and digital grounds separate, and use a solid ground plane. Additionally, place the device close to the sensing resistors and keep the signal traces short and shielded to minimize noise.
  • Calibration is critical for accurate energy measurement. The ADE7854ACPZ-RL requires a two-point calibration process: one for the voltage channel and one for the current channel. Use a high-accuracy voltage source and current source to calibrate the device. Refer to the application note AN-1074 for a detailed calibration procedure.
  • The ADE7854ACPZ-RL can handle voltage and current inputs up to 1 kHz. However, the device's performance may degrade at higher frequencies due to the internal filtering and sampling rates. For applications requiring higher frequency measurements, consider using an external anti-aliasing filter or a different device.
  • Yes, the ADE7854ACPZ-RL can be used for three-phase energy measurement applications. However, it requires an external phase-shift circuit to convert the three-phase signals to a single-phase signal that the device can measure. Refer to the application note AN-1075 for a detailed design example.
  • The ADE7854ACPZ-RL is specified to operate from -40°C to +85°C. Ensure that the device is properly heatsinked and that the PCB is designed to dissipate heat efficiently. Monitor the device's temperature using an external temperature sensor or the internal temperature sensor (if available) to prevent overheating.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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