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ADE7880ACPZ - Analog Devices

Description: Analog Devices ADE7880ACPZ Energy Measurement IC, 40-Pin LFCSP WQ

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Symbol
ADE7880ACPZ - Analog Devices - PCB symbol
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PCB Footprints
ADE7880ACPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-40-10 (LFCSP)
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3D Models
ADE7880ACPZ - Analog Devices - 3D model - Quad Flat No-Lead - CP-40-10 (LFCSP)
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ADE7880ACPZ Details

  • Manufacturer Part Number:

    ADE7880ACPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    6 X 6 MM, ROHS COMPLIANT, MO-220WJJD, LFCSP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    CP-40-10

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    28 mA

  • Supply Voltage-Max (Vsup):

    3.7 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

ADE7880ACPZ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the ADE7880ACPZ involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing the device close to the voltage reference pin. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To optimize the ADE7880ACPZ for low-power operation, use the lowest possible clock frequency, disable unused features, and use the power-down mode when not in use. Additionally, consider using a lower voltage supply and optimizing the analog front-end design.
  • The recommended calibration procedure for the ADE7880ACPZ involves a two-point calibration process, where the device is calibrated at two different voltage levels to determine the gain and offset of the ADC. The calibration process should be performed at the operating temperature range of the device.
  • To handle EMI with the ADE7880ACPZ, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode filter on the analog input pins. Additionally, consider using a ferrite bead or a common-mode choke on the power supply lines.
  • The recommended method for debugging the ADE7880ACPZ involves using a logic analyzer or an oscilloscope to monitor the digital signals, and using a multimeter or an oscilloscope to monitor the analog signals. Additionally, consider using the device's built-in diagnostic features, such as the internal voltage reference and the analog-to-digital converter (ADC) test modes.

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ADE7880ACPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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