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ADF4113BCPZ - Analog Devices

Description: ADF4113BCPZ, PLL Frequency Synthesizer, 20-Pin CP 20

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PCB Footprints
ADF4113BCPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-20-6 (LFCSP)
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3D Models
ADF4113BCPZ - Analog Devices  - 3D model - Quad Flat No-Lead - CP-20-6 (LFCSP)
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ADF4113BCPZ Details

  • Manufacturer Part Number:

    ADF4113BCPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    MO-220-VGGD, LFCSP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    CP-20-6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    6-BIT SWALLOW COUNTER

  • Analog IC - Other Type:

    PLL FREQUENCY SYNTHESIZER

  • JESD-30 Code:

    S-CQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC20,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    11 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

ADF4113BCPZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADF4113BCPZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the voltage regulator. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves setting the correct charge pump current, programming the N-divider, and adjusting the R-divider. It's also important to ensure that the device is operated within the recommended operating conditions.
  • When selecting external components for the ADF4113BCPZ, consider the frequency range, output power, and impedance matching requirements. Choose components with low parasitic inductance and capacitance, and ensure that the loop filter components are selected to optimize phase noise performance.
  • To troubleshoot common issues with the ADF4113BCPZ, start by verifying the power supply voltage, checking for proper PCB layout and component selection, and ensuring that the device is operated within the recommended operating conditions. Use a spectrum analyzer to measure the output spectrum and identify any spurious signals or phase noise.
  • The ADF4113BCPZ has a maximum junction temperature of 150°C. To ensure reliable operation over temperature, use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Additionally, follow the recommended operating conditions and avoid overheating the device.

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ADF4113BCPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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