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ADF5000BCPZ - Analog Devices

Description: ANALOG DEVICES - ADF5000BCPZ - PLL Frequency Synthesis, 18 GHz, 3 V to 3.6 V supply, LFCSP-16

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Symbol
ADF5000BCPZ - Analog Devices - PCB symbol
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PCB Footprints
ADF5000BCPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-16-18
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3D Models
ADF5000BCPZ - Analog Devices - 3D model - Quad Flat No-Lead - CP-16-18
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ADF5000BCPZ Details

  • Manufacturer Part Number:

    ADF5000BCPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-18

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Family:

    5000

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    PRESCALER

  • Max Frequency@Nom-Sup:

    18000000000 Hz

  • Moisture Sensitivity Level:

    3

  • Number of Data/Clock Inputs:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    60 mA

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADF5000BCPZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a star-grounding scheme to minimize noise.
  • Use a combination of ceramic and electrolytic capacitors for power supply decoupling. Place a 10uF ceramic capacitor close to the device, and a 10uF electrolytic capacitor further away. Ensure the capacitors are connected to a solid ground plane.
  • Use a low-jitter clock source, such as a crystal oscillator or a high-quality clock generator. Ensure the clock signal is properly terminated and routed to minimize reflections and noise.
  • Use a synchronous interface with a clock signal, and ensure the data and clock signals are properly terminated and routed. Use a data transmission protocol with error detection and correction, such as SPI or I2C.
  • Use a heat sink with a thermal conductivity of at least 1 W/m-K, and ensure good airflow around the device. Keep the device away from other heat sources, and use thermal interface material to improve heat transfer.

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ADF5000BCPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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