Part Image

ADG1419BRMZ-REEL7 - Analog Devices

Description: Analog Switch ICs 2:1 135MHz 2.1 Ohm iCMOS SPDT

Download ADG1419BRMZ-REEL7 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
ADG1419BRMZ-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Mini Small Outline Package [MSOP] (RM-8)
click to zoom
3D Models
ADG1419BRMZ-REEL7 - Analog Devices  - 3D model - Small Outline Packages - 8-Lead Mini Small Outline Package [MSOP] (RM-8)
click to zoom

ADG1419BRMZ-REEL7 Details

  • Manufacturer Part Number:

    ADG1419BRMZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    ROHS COMPLIANT, MO-187AA, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RM-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -16.5 V

  • Neg Supply Voltage-Min (Vsup):

    -13.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    64 dB

  • On-state Resistance Match-Nom:

    0.05 Ω

  • On-state Resistance-Max (Ron):

    3.2 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.215 A

  • Supply Current-Max (Isup):

    0.095 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    180 ns

  • Switch-on Time-Max:

    140 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADG1419BRMZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout practice is to use a solid ground plane, keep the signal traces short and away from the power planes, and use a symmetrical layout to minimize parasitic inductance and capacitance. Additionally, it is recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling, use a low-ESR capacitor (e.g., 0.1 μF) between the VDD and GND pins, and a larger capacitor (e.g., 10 μF) between the VDD and GND pins for bulk decoupling. Additionally, use a low-dropout regulator (LDO) or a switching regulator with a low output impedance to power the device.
  • The ADG1419BRMZ-REEL7 is a high-speed analog switch with a maximum operating frequency of 300 MHz. However, the actual operating frequency may be limited by the specific application, PCB layout, and signal integrity considerations.
  • To handle ESD protection, use a TVS (transient voltage suppressor) diode or an ESD protection device (e.g., 1.5 kΩ resistor and 22 pF capacitor) between the signal lines and the GND pin. Additionally, follow proper ESD handling procedures during assembly and testing.
  • To ensure proper thermal management, use a thermal pad or a heat sink on the exposed pad of the QFN package. Additionally, ensure good airflow around the device and avoid blocking the airflow with other components or obstacles.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

ADG1419BRMZ-REEL7 Overview

Use the download button to access the ADG1419BRMZ-REEL7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ADG14, or try a keyword search, such as Multiplexers or Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

Parts related to ADG1419BRMZ-REEL7

Showing 0 results

ADG1419BRMZ-REEL7 Alternates

Showing results

Image Part Number Model
Part Image ADG1419BRMZ Analog Devices Inc

SPDT, 1 Func, 1 Channel, BICMOS, PDSO8