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ADG1609BCPZ-REEL7 - Analog Devices

Description: 2x4:1 MUX

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ADG1609BCPZ-REEL7 - Analog Devices - PCB symbol
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PCB Footprints
ADG1609BCPZ-REEL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-16-22 [LFCSP_WQ]
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ADG1609BCPZ-REEL7 - Analog Devices - 3D model - Quad Flat No-Lead - CP-16-22 [LFCSP_WQ]
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ADG1609BCPZ-REEL7 Details

  • Manufacturer Part Number:

    ADG1609BCPZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, MO-220WEED, LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-22

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -8 V

  • Neg Supply Voltage-Min (Vsup):

    -3.3 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    64 dB

  • On-state Resistance Match-Nom:

    0.12 Ω

  • On-state Resistance-Max (Ron):

    5 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.255 A

  • Supply Current-Max (Isup):

    0.36 mA

  • Supply Voltage-Max (Vsup):

    8 V

  • Supply Voltage-Min (Vsup):

    3.3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    202 ns

  • Switch-on Time-Max:

    160 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADG1609BCPZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG1609BCPZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and ensuring good airflow around the device. Additionally, it's recommended to derate the device's power consumption and operating frequency at high temperatures.
  • The recommended power-up sequence for the ADG1609BCPZ-REEL7 is to first apply the analog supply voltage (VCCA) and then the digital supply voltage (VCCD). This ensures that the analog circuitry is powered up before the digital circuitry, which helps to prevent any potential latch-up conditions.
  • To troubleshoot issues with the ADG1609BCPZ-REEL7, start by verifying that the power supplies are within the recommended operating range and that the device is properly configured. Use an oscilloscope to check the signal waveforms and verify that the device is operating within the specified frequency range. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines.
  • The ADG1609BCPZ-REEL7 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device. This includes using an ESD wrist strap or mat, storing the device in an ESD-safe environment, and avoiding direct contact with the device's pins.

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ADG1609BCPZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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