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ADG3233BRJZ-REEL7 - Analog Devices

Description: ANALOG DEVICES - ADG3233BRJZ-REEL7 - LEVEL TRANSLATOR, 2I/P, SOT-23-8

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ADG3233BRJZ-REEL7 - Analog Devices PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - RJ-8 (SOT23)_1
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ADG3233BRJZ-REEL7 - Analog Devices  - 3D model - SOT23 (8-Pin) - RJ-8 (SOT23)_1
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ADG3233BRJZ-REEL7 Details

  • Manufacturer Part Number:

    ADG3233BRJZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOT-23, 8 PIN

  • Pin Count:

    8

  • Manufacturer Package Code:

    RJ-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Delay-Max:

    10.5 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSSOP8,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

ADG3233BRJZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG3233BRJZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce EMI and noise.
  • To ensure proper powering and decoupling of the ADG3233BRJZ-REEL7, use a high-quality, low-ESR capacitor (e.g., 10uF) between the VCC and GND pins, and a smaller capacitor (e.g., 100nF) between the VCC and GND pins for high-frequency decoupling. Also, ensure that the power supply is clean and well-regulated.
  • The ADG3233BRJZ-REEL7 is rated for operation from -40°C to +125°C, but the device's performance may degrade at extreme temperatures. It's essential to ensure proper thermal management and heat dissipation to maintain reliable operation.
  • The ADG3233BRJZ-REEL7's POR and BOR features can be handled by ensuring that the power supply is stable and well-regulated, and by using an external reset circuit or a microcontroller to monitor the power supply and reset the device as needed.
  • The recommended termination resistors for the ADG3233BRJZ-REEL7's digital outputs depend on the specific application and the load impedance. A general guideline is to use a series resistor (e.g., 22Ω to 47Ω) to match the output impedance of the device to the load impedance.

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ADG3233BRJZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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