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ADG3300BRUZ-REEL7 - Analog Devices

Description: 8-Channel Translator

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ADG3300BRUZ-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 20-Lead TSSOP
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ADG3300BRUZ-REEL7 - Analog Devices  - 3D model - Small Outline Packages - 20-Lead TSSOP
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ADG3300BRUZ-REEL7 Details

  • Manufacturer Part Number:

    ADG3300BRUZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    RU-20

  • Similar Group:

    IF00108911221052

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Delay-Max:

    35 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

ADG3300BRUZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG3300BRUZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The ADG3300BRUZ-REEL7 requires a single 3.3V power supply. It's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the VDD pin before the VLOGIC pin. The VDD pin should be powered up first, followed by the VLOGIC pin.
  • The maximum operating frequency of the ADG3300BRUZ-REEL7 is 100 MHz. Operating the device at frequencies above 100 MHz may result in reduced performance, increased power consumption, and decreased signal integrity.
  • The ADG3300BRUZ-REEL7 has a maximum junction temperature (TJ) of 150°C. To ensure proper thermal management, it's recommended to use a heat sink or a thermal pad, and to keep the device away from other heat sources. The device should be operated within the recommended operating temperature range of -40°C to 125°C.
  • The ADG3300BRUZ-REEL7 has built-in ESD protection diodes on all pins. To prevent latch-up, it's recommended to use a series resistor on the input pins, and to ensure that the input signals are within the recommended voltage range.

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ADG3300BRUZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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