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ADG3304BCBZ-REEL7 - Analog Devices

Description: Low Voltage 1.15 V to 5.5 V, 4 Channel, Bidirectional, Logic Level Translator

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PCB Footprints
ADG3304BCBZ-REEL7 - Analog Devices PCB footprint - BGA - BGA - 12-Ball Wafer Level Chip Scale Package*
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3D Models
ADG3304BCBZ-REEL7 - Analog Devices  - 3D model - BGA - 12-Ball Wafer Level Chip Scale Package*
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ADG3304BCBZ-REEL7 Details

  • Manufacturer Part Number:

    ADG3304BCBZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    WLCSP-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    CB-12-1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Delay-Max:

    35 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-XBGA-B12

  • JESD-609 Code:

    e1

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA12,3X4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.57 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1.5 mm

ADG3304BCBZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG3304 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling of the ADG3304, use a high-quality, low-ESR capacitor (e.g., 10uF) between the VDD and GND pins, and a smaller capacitor (e.g., 100nF) between the VDD and AVDD pins. Additionally, use a 1uF capacitor between the AVDD and AGND pins.
  • The ADG3304 can operate at frequencies up to 100 kHz, but the maximum operating frequency depends on the specific application and the quality of the PCB layout. In general, it's recommended to operate the device at frequencies below 50 kHz to ensure optimal performance.
  • The ADG3304 has a maximum junction temperature of 150°C. To ensure proper thermal management, use a heat sink or a thermal pad on the exposed pad of the device, and ensure good airflow around the device. Additionally, avoid overheating the device during soldering and rework.
  • The ADG3304 has built-in ESD protection, but it's still recommended to use external ESD protection devices, such as TVS diodes or ESD arrays, to protect the device from electrostatic discharge.

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ADG3304BCBZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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