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ADG3304SRUZ-EP-RL7 - Analog Devices

Description: Low Voltage 1.15 V to 5.5 V, 4 Channel, Bidirectional, Logic Level Translator

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ADG3304SRUZ-EP-RL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead Thin Shrink Small Outline Package [TSSOP]_014
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ADG3304SRUZ-EP-RL7 - Analog Devices  - 3D model - Small Outline Packages - 14-Lead Thin Shrink Small Outline Package [TSSOP]_014
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ADG3304SRUZ-EP-RL7 Details

  • Manufacturer Part Number:

    ADG3304SRUZ-EP-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    RU-14

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2018-02-26

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Delay-Max:

    40 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

ADG3304SRUZ-EP-RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG3304SRUZ-EP-RL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces connecting the device to the power supply and load. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure reliability in high-temperature applications, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range.
  • The ADG3304SRUZ-EP-RL7 has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding oneself before handling the device, and using an ESD wrist strap or mat.
  • The ADG3304SRUZ-EP-RL7 is a radiation-tolerant device, but it is not radiation-hardened. It is designed to meet the requirements of the aerospace industry, but it may not meet the requirements of all radiation-hardened applications. Consult with Analog Devices Inc for specific radiation testing and characterization data.
  • The recommended power-up sequence for the ADG3304SRUZ-EP-RL7 is to power up the VDD pin first, followed by the VCC pin. This ensures that the internal voltage regulators are properly initialized and that the device operates correctly.

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ADG3304SRUZ-EP-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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