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ADG5208BRUZ-RL7 - Analog Devices

Description: Multiplexer Switch ICs Latchup Proof,+/-20V,+/-15V,+12V,+36V 8-1MUX

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ADG5208BRUZ-RL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - (RU-16)
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ADG5208BRUZ-RL7 - Analog Devices  - 3D model - Small Outline Packages - (RU-16)
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ADG5208BRUZ-RL7 Details

  • Manufacturer Part Number:

    ADG5208BRUZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    ROHS COMPLIANT, MO-153AB, TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RU-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Additional Feature:

    VIDEO APPLICATION

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -22 V

  • Neg Supply Voltage-Min (Vsup):

    -9 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance Match-Nom:

    3.5 Ω

  • On-state Resistance-Max (Ron):

    200 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.042 A

  • Supply Current-Max (Isup):

    0.13 mA

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    180 ns

  • Switch-on Time-Max:

    245 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ADG5208BRUZ-RL7 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VSS, and then the logic inputs. This ensures that the device powers up in a stable state.
  • To ensure that the switches are properly turned off during power-down, it is recommended to drive the logic inputs to a valid state (either high or low) before powering down the device.
  • The maximum capacitance that can be driven by the ADG5208BRUZ-RL7 is dependent on the specific application and the frequency of operation. As a general guideline, the device can drive capacitances up to 100 pF.
  • Yes, the ADG5208BRUZ-RL7 can be used in high-frequency applications up to 1 GHz. However, the device's performance may degrade at higher frequencies, and additional design considerations may be necessary.
  • To minimize power consumption, it is recommended to use the lowest possible supply voltage, minimize the switching frequency, and use the device's built-in power-down mode when not in use.

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ADG5208BRUZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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