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ADG5408TCPZ-EP - Analog Devices

Description: Multiplexer Switch ICs 8:1 & Dual 4:1 Latch up proof Muxes.

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PCB Footprints
ADG5408TCPZ-EP - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - (CP-16-17)
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ADG5408TCPZ-EP - Analog Devices  - 3D model - Quad Flat No-Lead - (CP-16-17)
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ADG5408TCPZ-EP Details

  • Manufacturer Part Number:

    ADG5408TCPZ-EP

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-17

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -22 V

  • Neg Supply Voltage-Min (Vsup):

    -9 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    60 dB

  • On-state Resistance Match-Nom:

    0.3 Ω

  • On-state Resistance-Max (Ron):

    15 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.218 A

  • Supply Current-Max (Isup):

    0.155 mA

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    198 ns

  • Switch-on Time-Max:

    242 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ADG5408TCPZ-EP Frequently Asked Questions (FAQs)

  • A recommended PCB layout for the ADG5408TCPZ-EP is to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure proper powering and decoupling, use a low-ESR capacitor (e.g., 0.1 μF) between VDD and GND, and a 10 μF capacitor between VDD and GND for bulk decoupling. Also, use a 1 kΩ resistor in series with the VDD pin to prevent voltage spikes.
  • The ADG5408TCPZ-EP can operate up to 100 kHz, but the maximum operating frequency depends on the specific application and the signal frequency. It's recommended to consult the datasheet and application notes for more information.
  • To protect the ADG5408TCPZ-EP from ESD and overvoltage, use ESD protection diodes (e.g., TVS diodes) on the input pins, and consider adding a voltage regulator or overvoltage protection circuit to prevent voltage spikes.
  • A recommended thermal management strategy for the ADG5408TCPZ-EP is to use a heat sink or thermal pad on the top of the device, and to ensure good airflow around the device to dissipate heat efficiently.

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ADG5408TCPZ-EP Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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