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ADG601BRMZ-REEL7 - Analog Devices

Description: 1 Circuit IC Switch 1:1 2.5Ohm 8-MSOP , 2.7V ~ 5.5V ,2.5Ohm ,-40°C ~ 85°C (TA)

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ADG601BRMZ-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RM-8 (MSOP)
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ADG601BRMZ-REEL7 - Analog Devices  - 3D model - Small Outline Packages - RM-8 (MSOP)
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ADG601BRMZ-REEL7 Details

  • Manufacturer Part Number:

    ADG601BRMZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    ROHS COMPLIANT, MO-187AA, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RM-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    CAN ALSO OPERATE WITH 2.7V TO 5.5V SINGLE SUPPLY

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -5.5 V

  • Neg Supply Voltage-Min (Vsup):

    -2.7 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    60 dB

  • On-state Resistance Match-Nom:

    0.35 Ω

  • On-state Resistance-Max (Ron):

    2.5 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    75 ns

  • Switch-on Time-Max:

    120 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADG601BRMZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG601BRMZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, it's recommended to derate the device's power consumption and operating frequency at high temperatures.
  • The ADG601BRMZ-REEL7 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe workstations, wrist straps, and packaging materials, as well as minimizing the risk of static electricity generation during handling.
  • The ADG601BRMZ-REEL7 is not specifically designed or tested for radiation-hardened applications. If radiation hardness is required, it's recommended to consult with Analog Devices Inc. or a qualified radiation effects expert to determine the device's suitability for the specific application.
  • The recommended soldering conditions for the ADG601BRMZ-REEL7 include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that minimizes thermal stress on the device. For rework, it's recommended to use a low-temperature soldering iron and a solder wick or desoldering braid to minimize damage to the device.

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ADG601BRMZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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Part Image ADG601BRMZ-REEL Rochester Electronics LLC

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Part Image ADG601BRM Analog Devices Inc

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Part Image ADG601BRM-REEL Analog Devices Inc

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For a full list of alternate parts for ADG601BRMZ-REEL7, check out Findchips.com