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ADG732BCPZ - Analog Devices

Description: ADG732BCPZ, Analogue Switch Single 32:1, 3, 5V, 48-Pin, LFCSP EP

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PCB Footprints
ADG732BCPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48-Lead Frame Chip Scale Package [LFCSP] (CP-48)
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ADG732BCPZ - Analog Devices  - 3D model - Quad Flat No-Lead - 48-Lead Frame Chip Scale Package [LFCSP] (CP-48)
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ADG732BCPZ Details

  • Manufacturer Part Number:

    ADG732BCPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    CP-48-1

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERTES WITH 1.8V TO 5.5V SINGLE SUPPLY

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    S-XQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -2.75 V

  • Neg Supply Voltage-Min (Vsup):

    -2.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -2.5 V

  • Normal Position:

    NO

  • Number of Channels:

    32

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Off-state Isolation-Nom:

    72 dB

  • On-state Resistance Match-Nom:

    0.3 Ω

  • On-state Resistance-Max (Ron):

    5.5 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.03 A

  • Supply Current-Max (Isup):

    0.02 mA

  • Supply Voltage-Max (Vsup):

    2.75 V

  • Supply Voltage-Min (Vsup):

    2.25 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    26 ns

  • Switch-on Time-Max:

    37 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

ADG732BCPZ Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD before applying the analog signal. This ensures that the internal circuitry is properly biased before the analog signal is applied.
  • The ADG732BCPZ requires a 50Ω termination resistor to VDD at the output pins to ensure proper signal integrity. Additionally, the input pins should be terminated with a 50Ω resistor to GND.
  • The ADG732BCPZ can operate up to 250 MHz, but the actual operating frequency may be limited by the specific application and PCB layout.
  • To minimize power consumption, ensure that the input signals are properly terminated, and the output signals are not loaded excessively. Additionally, consider using a lower supply voltage (VDD) if possible.
  • Keep the input and output traces as short as possible, and use a ground plane to minimize noise and crosstalk. Avoid routing signals near the device's power pins to minimize noise coupling.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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