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ADG7421FBCPZ-RL7 - Analog Devices

Description: Analog Switch ICs +/- 60V OV Protected, 5V SPSTx1 Switch

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ADG7421FBCPZ-RL7 - Analog Devices - PCB symbol
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PCB Footprints
ADG7421FBCPZ-RL7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - CP-10-16
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3D Models
ADG7421FBCPZ-RL7 - Analog Devices - 3D model - Small Outline No-lead - CP-10-16
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ADG7421FBCPZ-RL7 Details

  • Manufacturer Part Number:

    ADG7421FBCPZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    CP-10-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-XBCS-N10

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    64 dB

  • On-state Resistance Match-Nom:

    0.01 Ω

  • On-state Resistance-Max (Ron):

    23 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    BCS

  • Package Equivalence Code:

    SOLCC10,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.85 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    210 ns

  • Switch-on Time-Max:

    5000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    2 mm

ADG7421FBCPZ-RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG7421FBCPZ-RL7 should include a solid ground plane, separate analog and digital grounds, and keep the analog and digital signals separate. Additionally, use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize EMI and noise.
  • To ensure proper powering and decoupling of the ADG7421FBCPZ-RL7, use a high-quality power supply with low ripple and noise, and add decoupling capacitors (e.g., 10uF and 100nF) close to the device's power pins. Also, use a 0.1uF capacitor between the VCC and GND pins.
  • The ADG7421FBCPZ-RL7 can operate up to 100 MHz, but the actual operating frequency depends on the specific application and the quality of the PCB layout and design.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, follow the recommended thermal design guidelines in the datasheet.
  • The recommended soldering profile for the ADG7421FBCPZ-RL7 is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. Follow the recommended soldering guidelines in the datasheet and use a soldering iron with a temperature control.

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ADG7421FBCPZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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