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ADG779BKS-REEL - Analog Devices

Description: IC SWITCH SPDT SC70-6

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PCB Footprints
ADG779BKS-REEL - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - KS-6 (SC70)_1
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ADG779BKS-REEL - Analog Devices  - 3D model - SOT23 (6-Pin) - KS-6 (SC70)_1
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ADG779BKS-REEL Details

  • Manufacturer Part Number:

    ADG779BKS-REEL

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    MO-203AB, SC-70, 6 PIN

  • Pin Count:

    6

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e0

  • Length:

    2 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    67 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • On-state Resistance-Max (Ron):

    10 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.03 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    7 ns

  • Switch-on Time-Max:

    24 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

ADG779BKS-REEL Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG779BKS-REEL involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and ensuring good airflow around the device. Additionally, the device should be operated within its recommended operating temperature range.
  • The ADG779BKS-REEL has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. This includes using an ESD wrist strap or mat, storing the devices in anti-static packaging, and using ESD-protected workstations.
  • The ADG779BKS-REEL is not specifically designed or tested for radiation-hardened applications. If radiation hardness is required, it's recommended to consult with Analog Devices Inc. or a qualified radiation effects expert to determine the suitability of the device for the specific application.
  • The ADG779BKS-REEL should be stored in its original packaging or in a dry, cool place away from direct sunlight. The devices should be handled with care to avoid mechanical stress, and electrostatic discharge (ESD) precautions should be taken during handling and assembly.

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ADG779BKS-REEL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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