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- Stock & Prices $ Price & Stock for ADG779BKS-REEL7
- Part Number ADG779BKS-REEL7
- Manufacturer Analog Devices
- Pin Count 6
- Part Category Integrated Circuit
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - SC70-KS6
- Released Date May 19, 2022
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
ADG779BKS-REEL7 Details
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Manufacturer Part Number:
ADG779BKS-REEL7
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Pbfree Code:
No
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Part Life Cycle Code:
Active
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Part Package Code:
TSSOP
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Package Description:
MO-203AB, SC-70, 6 PIN
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Pin Count:
6
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HTS Code:
8542.39.00.60
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Manufacturer:
Analog Devices Inc
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YTEOL:
8.5
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Analog IC - Other Type:
SPDT
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JESD-30 Code:
R-PDSO-G6
ADG779BKS-REEL7 Frequently Asked Questions (FAQs)
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A good PCB layout for the ADG779BKS-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. Additionally, it's recommended to place the device close to the analog signal sources and use shielding to reduce electromagnetic interference (EMI).
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To ensure the ADG779BKS-REEL7 operates within its specified temperature range of -40°C to 125°C, it's essential to provide adequate heat sinking, avoid overheating, and use a thermally conductive material for the PCB. Additionally, consider using thermal interface materials (TIMs) and heat sinks to dissipate heat effectively.
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The recommended power-up sequence for the ADG779BKS-REEL7 is to apply the analog supply voltage (VDDA) first, followed by the digital supply voltage (VDDD). This ensures that the analog circuitry is powered up before the digital circuitry, which helps to prevent latch-up and ensures proper device operation.
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To handle ESD protection for the ADG779BKS-REEL7, it's recommended to use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Additionally, follow proper handling and storage procedures to prevent ESD damage during manufacturing and assembly.
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The recommended method for soldering the ADG779BKS-REEL7 is to use a reflow soldering process with a peak temperature of 260°C. Avoid using wave soldering or hand soldering, as these methods can cause damage to the device. Follow the recommended soldering profile and use a solder with a low melting point to prevent thermal damage.
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ADG779BKS-REEL7 Overview
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About Analog Devices
Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries.
Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.