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ADG779BKSZ-REEL7 - Analog Devices

Description: SPDT Switch

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ADG779BKSZ-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SC70-KS6
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ADG779BKSZ-REEL7 - Analog Devices  - 3D model - Small Outline Packages - SC70-KS6
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ADG779BKSZ-REEL7 Details

  • Manufacturer Part Number:

    ADG779BKSZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    LEAD FREE, MO-203AB, SC-70, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    KS-6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    67 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • On-state Resistance-Max (Ron):

    10 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.03 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    7 ns

  • Switch-on Time-Max:

    24 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

ADG779BKSZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG779BKSZ-REEL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane.
  • The ADG779BKSZ-REEL7 requires a single 1.8V to 5.5V power supply. It's recommended to power the device with a low-noise, low-dropout regulator. The power sequencing requirement is to power up the analog supply (VDD) before the digital supply (VDDIO).
  • The recommended clock frequency for the ADG779BKSZ-REEL7 is 1 MHz to 50 MHz. The clock signal should have a low jitter (<100 ps) and a duty cycle of 40% to 60%. A clock signal with a square wave shape is recommended.
  • The ADG779BKSZ-REEL7 has a maximum junction temperature of 125°C. To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB, use a heat sink if necessary, and ensure good airflow around the device.
  • The ADG779BKSZ-REEL7 has an ESD rating of 2 kV human body model (HBM) and 200 V machine model (MM). To ensure ESD protection, it's recommended to use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins.

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ADG779BKSZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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