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- Part Number ADG804YRMZ
- Manufacturer Analog Devices
- Pin Count 10
- Part Category Integrated Circuit
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - RM-10__js
- Released Date Jan 10, 2017
- Last Modified Date May 27, 2025 4:11 AM UTC
- Pinout / Pin List Click Here (Member Only)
ADG804YRMZ Details
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Manufacturer Part Number:
ADG804YRMZ
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Brand Name:
Analog Devices Inc
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Pbfree Code:
No
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Part Package Code:
TSSOP
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Package Description:
MSOP-10
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Pin Count:
10
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Manufacturer Package Code:
RM-10
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Country Of Origin:
Malaysia
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.01
ADG804YRMZ Frequently Asked Questions (FAQs)
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A good PCB layout for the ADG804YRMZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce EMI and noise.
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To ensure proper powering and decoupling of the ADG804YRMZ, use a low-ESR capacitor (e.g., 0.1 μF) between the VDD and GND pins, and a larger capacitor (e.g., 10 μF) between the VDD and GND pins for bulk decoupling. Also, use a low-dropout regulator (LDO) or a switching regulator with a low noise output to power the device.
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The ADG804YRMZ is a high-speed analog switch with a maximum operating frequency of 200 MHz. However, the actual operating frequency may be limited by the specific application, PCB layout, and signal integrity considerations.
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The ADG804YRMZ has a built-in power-on reset (POR) and brown-out reset (BOR) features. To handle these features, ensure that the power supply voltage (VDD) is stable and within the recommended operating range (1.65 V to 3.6 V) before applying the input signals. Also, use a capacitor (e.g., 0.1 μF) between the VDD and GND pins to filter out any noise or glitches that may trigger the POR or BOR features.
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The ADG804YRMZ has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, use a thermal management strategy that keeps the device temperature below 125°C. This can be achieved by using a heat sink, thermal interface material, or a thermally conductive PCB substrate.
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ADG804YRMZ Overview
Use the download button to access the ADG804YRMZ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ADG80,
or try a keyword search, such as Multiplexers or Switches
About Analog Devices
Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries.
Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.
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