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ADG849YKSZ-500RL7 - Analog Devices

Description: SPDT/2:1 Mux

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PCB Footprints
ADG849YKSZ-500RL7 - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - KS-6_ SC70
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ADG849YKSZ-500RL7 - Analog Devices  - 3D model - SOT23 (6-Pin) - KS-6_ SC70
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ADG849YKSZ-500RL7 Details

  • Manufacturer Part Number:

    ADG849YKSZ-500RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    LEAD FREE, MO-203AB, SC-70, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    KS-6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    64 dB

  • On-state Resistance Match-Nom:

    0.05 Ω

  • On-state Resistance-Max (Ron):

    0.6 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.4 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    13 ns

  • Switch-on Time-Max:

    15 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

ADG849YKSZ-500RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADG849YKSZ-500RL7 should minimize parasitic inductance and capacitance. Keep the signal paths short, use a solid ground plane, and avoid vias under the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • Ensure good thermal conductivity by using a heat sink or a thermal pad on the exposed pad of the device. Keep the device away from heat sources and ensure good airflow. Monitor the junction temperature (TJ) to prevent overheating.
  • Power up the device in the following sequence: VDD, then VCC. Ensure VDD is stable before applying VCC. This sequence helps prevent latch-up and ensures proper device operation.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins. Follow proper PCB design guidelines for ESD protection, and ensure the device is handled and stored in an ESD-safe environment.
  • Use termination resistors with a value between 50 ohms and 100 ohms to match the impedance of the transmission line. The exact value depends on the specific application and signal frequency.

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ADG849YKSZ-500RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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