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ADG901SCPZ-EP-RL7 - Analog Devices

Description: RF Switch ICs 1GHz SPST Sw. (50 Ohm Termination) I.C.

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ADG901SCPZ-EP-RL7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - (CP-8-13)
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ADG901SCPZ-EP-RL7 - Analog Devices  - 3D model - Small Outline No-lead - (CP-8-13)
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ADG901SCPZ-EP-RL7 Details

  • Manufacturer Part Number:

    ADG901SCPZ-EP-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    CP-8-13

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • 1dB Compression Point:

    17 dBm

  • Additional Feature:

    CMOS COMPATIBLE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    18 dBm

  • Insertion Loss-Max:

    1.25 dB

  • Isolation-Min:

    31 dB

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • On Time-Nom:

    0.004 µs

  • Operating Frequency-Max:

    1000 MHz

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Port Termination:

    ABSORPTIVE

  • Power Supplies:

    1.65/2.75 V

  • RF/Microwave Device Type:

    SPST

  • Supply Current-Max:

    70 mA

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • VSWR-Max:

    1.08

ADG901SCPZ-EP-RL7 Frequently Asked Questions (FAQs)

  • Analog Devices provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, routing, and thermal management. Additionally, it's essential to follow good PCB design practices, such as minimizing signal trace lengths, using ground planes, and avoiding noise coupling.
  • To ensure reliability and longevity, follow proper handling and storage procedures, and operate the device within its recommended operating conditions. Implement proper thermal management, such as heat sinking and airflow, to prevent overheating. Additionally, consider using conformal coating and encapsulation to protect the device from moisture and contaminants.
  • Potential failure modes include overheating, electrical overstress, and mechanical stress. To mitigate these, ensure proper thermal management, operate the device within its recommended voltage and current ratings, and handle the device with care to prevent mechanical damage. Implementing redundancy, error detection, and correction mechanisms can also help mitigate failures.
  • The ADG901SCPZ-EP-RL7 is a radiation-hardened device, designed to withstand total ionizing dose (TID) and single-event effects (SEE). However, it's essential to consult the datasheet and radiation reports to ensure the device meets the specific radiation requirements of your application.
  • To troubleshoot issues, start by consulting the datasheet and application notes. Verify that the device is operated within its recommended conditions, and check for proper PCB layout and component selection. Use debugging tools, such as oscilloscopes and logic analyzers, to identify the root cause of the issue. If necessary, contact Analog Devices' technical support for further assistance.

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ADG901SCPZ-EP-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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