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ADIS16507-3BMLZ - Analog Devices

Description: IMUs - Inertial Measurement Units 6 DOF Prec IMU, 40g (2000 DPS DNR)

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ADIS16507-3BMLZ - Analog Devices PCB footprint - BGA - BGA - 100-Ball Ball Grid Array Module [BGA] (ML-100-1)
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ADIS16507-3BMLZ - Analog Devices  - 3D model - BGA - 100-Ball Ball Grid Array Module [BGA] (ML-100-1)
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ADIS16507-3BMLZ Details

  • Manufacturer Part Number:

    ADIS16507-3BMLZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    ML-100-1

  • Country Of Origin:

    USA

  • ECCN Code:

    7A994

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-10-29

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    5

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA100,10X10,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    6.077 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

ADIS16507-3BMLZ Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow a 4-layer PCB stack-up with a solid ground plane, and to keep the analog and digital signals separate. Additionally, decoupling capacitors should be placed close to the device, and the power supply lines should be routed away from the sensitive analog signals.
  • The ADIS16507-3BMLZ has an internal calibration mechanism that can be accessed through the SPI interface. The device can be calibrated using the CAL_X, CAL_Y, and CAL_Z registers to adjust the scale factors and offset values. It is recommended to perform calibration at multiple temperatures and orientations to ensure optimal accuracy and performance.
  • The ADIS16507-3BMLZ is rated for operation from -40°C to +105°C, but the device's accuracy and performance may degrade at extreme temperatures. It is recommended to operate the device within the -20°C to +70°C range for optimal performance.
  • To minimize noise and EMI sensitivity, it is recommended to use a low-pass filter on the analog outputs, and to shield the device and its connections from external electromagnetic interference. Additionally, the device's digital outputs should be isolated from the analog signals using a digital isolator or optocoupler.
  • The recommended power-up sequence is to apply the analog power supply (VCC) first, followed by the digital power supply (VDD). During power-down, the sequence should be reversed. It is also recommended to add a power-on reset circuit to ensure the device is properly initialized.

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ADIS16507-3BMLZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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