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ADM3057EBRWZ - Analog Devices

Description: 3 kV rms, Signal and Power Isolated, CAN Transceiver for CAN FD

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ADM3057EBRWZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 20-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-20)
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ADM3057EBRWZ - Analog Devices  - 3D model - Small Outline Packages - 20-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-20)
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ADM3057EBRWZ Details

  • Manufacturer Part Number:

    ADM3057EBRWZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    RW-20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2018-11-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN FD TRANSCEIVER

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

ADM3057EBRWZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADM3057EBRWZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the isolation barrier. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable operation of the ADM3057EBRWZ in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range.
  • When using the ADM3057EBRWZ in a system with a high common-mode voltage, it's essential to ensure that the device is operated within its specified common-mode voltage range. Exceeding this range can lead to reduced accuracy, increased noise, and potentially even device damage. It's recommended to use external circuitry to attenuate the common-mode voltage if necessary.
  • To troubleshoot issues with the ADM3057EBRWZ, start by verifying that the device is properly powered and that the input and output voltages are within the specified ranges. Check for any signs of physical damage or contamination on the device or PCB. Use an oscilloscope to measure the output voltage and noise levels, and consult the datasheet for guidance on troubleshooting specific issues.
  • The ADM3057EBRWZ is designed to operate with a specific isolation voltage rating. Using the device in a system with a different isolation voltage rating may compromise its safety and performance. It's recommended to consult with Analog Devices Inc. or a qualified engineer to determine the feasibility of using the device in a system with a different isolation voltage rating.

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ADM3057EBRWZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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