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ADM7154ACPZ-3.3-R7 - Analog Devices

Description: ANALOG DEVICES - ADM7154ACPZ-3.3-R7 - LDO, FIXED, 3.3V, 0.6A, LFCSP-8

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ADM7154ACPZ-3.3-R7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Lead LFCSP_WD (CP-8-21)
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ADM7154ACPZ-3.3-R7 - Analog Devices  - 3D model - Small Outline No-lead - 8-Lead LFCSP_WD (CP-8-21)
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ADM7154ACPZ-3.3-R7 Details

  • Manufacturer Part Number:

    ADM7154ACPZ-3.3-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    CP-8-21

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.21 V

  • Dropout Voltage1-Nom:

    0.12 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.0036168%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.6 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Technology:

    PMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2%

  • Width:

    3 mm

ADM7154ACPZ-3.3-R7 Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the ADM7154ACPZ-3.3-R7 is 6.5V, as specified in the datasheet. However, it's recommended to operate the device within the recommended input voltage range of 3.3V ±10% to ensure optimal performance and reliability.
  • To ensure proper bypassing, place a 1μF to 10μF ceramic capacitor between the VIN pin and the GND pin, as close to the device as possible. This helps to filter out high-frequency noise and ensure stable operation.
  • The minimum output capacitance required for the ADM7154ACPZ-3.3-R7 is 1μF, as specified in the datasheet. However, using a larger output capacitor (e.g., 4.7μF to 10μF) can help improve the regulator's transient response and stability.
  • The ADM7154ACPZ-3.3-R7 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the device's thermal characteristics and ensure proper thermal management in high-temperature applications.
  • To determine the power dissipation of the ADM7154ACPZ-3.3-R7, calculate the voltage drop across the device (VIN - VOUT) and multiply it by the output current (IOUT). The result is the power dissipation in watts (W). For example, if VIN = 5V, VOUT = 3.3V, and IOUT = 500mA, the power dissipation would be (5V - 3.3V) x 0.5A = 0.85W.

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ADM7154ACPZ-3.3-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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