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ADM7170ACPZ-1.8-R7 - Analog Devices

Description: LDO Voltage Regulators 0.5A Hi PSRR FT LDO 1.8Vo

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ADM7170ACPZ-1.8-R7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - . 8-Lead Lead Frame Chip Scale Package [LFCSP]
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ADM7170ACPZ-1.8-R7 - Analog Devices  - 3D model - Small Outline No-lead - . 8-Lead Lead Frame Chip Scale Package [LFCSP]
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ADM7170ACPZ-1.8-R7 Details

  • Manufacturer Part Number:

    ADM7170ACPZ-1.8-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    CP-8-21

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    6.5 V

  • Input Voltage-Min:

    2.3 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.00756%

  • Load Regulation-Max:

    0.00539892%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    1.8225 V

  • Output Voltage1-Min:

    1.7775 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    1.3%

  • Width:

    3 mm

ADM7170ACPZ-1.8-R7 Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the ADM7170ACPZ-1.8-R7 involves placing the device close to the power source, using a solid ground plane, and minimizing the length of the input and output traces to reduce noise and improve stability.
  • To ensure stability, ensure that the output capacitor is within the recommended range, the input voltage is within the specified range, and the device is properly decoupled from the power source. Additionally, avoid using long input and output traces and minimize the use of vias.
  • The maximum input voltage that the ADM7170ACPZ-1.8-R7 can handle is 5.5V. Exceeding this voltage may damage the device.
  • The ADM7170ACPZ-1.8-R7 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's performance and consider using thermal management techniques to ensure reliable operation.
  • The output voltage of the ADM7170ACPZ-1.8-R7 can be calculated using the formula: VOUT = (VIN x (R1 + R2) / R2) + VREF, where VIN is the input voltage, R1 and R2 are the resistors in the feedback network, and VREF is the reference voltage.

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ADM7170ACPZ-1.8-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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