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ADN4650BRSZ-RL7 - Analog Devices

Description: 5 kV rms, 600 Mbps Dual Tx or Rx Channel LVDS Isolator

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ADN4650BRSZ-RL7 - Analog Devices - PCB symbol
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ADN4650BRSZ-RL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RS-20 (SSOP)
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ADN4650BRSZ-RL7 - Analog Devices - 3D model - Small Outline Packages - RS-20 (SSOP)
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ADN4650BRSZ-RL7 Details

  • Manufacturer Part Number:

    ADN4650BRSZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    RS-20

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2016-09-08

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    ISOLATED LVDS BUFFER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    7.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

ADN4650BRSZ-RL7 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize crosstalk. Use a common mode choke or a ferrite bead to filter the input power supply.
  • Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking airflow to the device. Monitor the device's junction temperature (TJ) and adjust the system design accordingly to prevent overheating.
  • Use a 50Ω termination resistor at the input and output of the device to match the impedance of the transmission line. This ensures maximum power transfer and minimizes signal reflections.
  • Use ESD protection devices such as TVS diodes or ESD arrays at the input and output of the device. Follow proper PCB design and handling practices to prevent ESD damage during manufacturing and assembly.
  • Use a combination of ceramic and electrolytic capacitors to decouple the power supply. Place a 10uF ceramic capacitor and a 10uF electrolytic capacitor in parallel as close to the device's power pins as possible.

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ADN4650BRSZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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