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ADN4651BRWZ-RL7 - Analog Devices

Description: 5 kV rms, 600 Mbps Dual Tx and Rx Channel LVDS Isolator

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ADN4651BRWZ-RL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 20-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-20)
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ADN4651BRWZ-RL7 - Analog Devices  - 3D model - Small Outline Packages - 20-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-20)
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ADN4651BRWZ-RL7 Details

  • Manufacturer Part Number:

    ADN4651BRWZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    RW-20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    ISOLATED LVDS BUFFER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ADN4651BRWZ-RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADN4651BRWZ-RL7 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and minimizing the distance between the device and the load. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and decouple it with a 0.1uF capacitor to ground. The VEE pin should be connected to a quiet ground or a local ground plane. Avoid using a voltage regulator with high output impedance.
  • The ADN4651BRWZ-RL7 can support data rates up to 3.2 Gbps, but the actual achievable data rate depends on the specific application, PCB layout, and signal integrity. It's recommended to perform signal integrity simulations and testing to determine the maximum achievable data rate.
  • The ADN4651BRWZ-RL7 has a maximum junction temperature of 150°C. To ensure reliable operation, keep the device temperature below 125°C. Use a thermal pad or heat sink to dissipate heat, and ensure good airflow around the device. Avoid blocking airflow or using thermal insulation materials.
  • The ADN4651BRWZ-RL7 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.

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ADN4651BRWZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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Part Image ADN4651BRWZ Analog Devices Inc

PDSO20