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ADN4652BRWZ - Analog Devices

Description: DGT ISO 5000VRMS 2CH LVDS 20SOIC

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ADN4652BRWZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RW-20 (SOIC)
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ADN4652BRWZ - Analog Devices  - 3D model - Small Outline Packages - RW-20 (SOIC)
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ADN4652BRWZ Details

  • Manufacturer Part Number:

    ADN4652BRWZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    RW-20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2016-04-07

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    ISOLATED LVDS BUFFER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ADN4652BRWZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADN4652BRWZ involves keeping the signal paths short, using a solid ground plane, and separating the analog and digital sections. It's also recommended to use a 4-layer PCB with a dedicated power plane and to follow the layout guidelines provided in the ADN4652BRWZ evaluation board documentation.
  • To ensure proper powering and decoupling, use a low-ESR capacitor (e.g., 0.1 μF) between the VCC and GND pins, and a 10 μF capacitor between the VCC and AVCC pins. Additionally, use a separate power plane for the analog and digital sections, and ensure that the power supply is clean and well-regulated.
  • The ADN4652BRWZ can support data rates up to 3.2 Gbps, but the actual data rate achievable depends on the specific application, PCB layout, and signal quality. It's recommended to consult the datasheet and application notes for more information on achieving high-speed data transmission.
  • To troubleshoot common issues, use a combination of tools such as oscilloscopes, signal generators, and logic analyzers to analyze the signal quality and power supply noise. Consult the ADN4652BRWZ datasheet and application notes for guidance on troubleshooting and debugging techniques.
  • Yes, the ADN4652BRWZ has a maximum junction temperature of 150°C, and it's essential to ensure proper thermal management to prevent overheating. Use a heat sink or thermal pad, and ensure good airflow around the device. Consult the datasheet for more information on thermal management and junction temperature calculations.

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ADN4652BRWZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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