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ADP02STR04 - TE Connectivity

Description: DIP Switch, Gold Contact Plating, Black, Polyphenylene Sulfide (PPS), 2 Switch, -30 – 85 °C [-22 – 185 °F], Piano (Side Actuated), ALCOSWITCH DIP

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PCB Footprints
ADP02STR04 - TE Connectivity PCB footprint - Other - Other - ADP02STR04-2
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3D Models
ADP02STR04 - TE Connectivity  - 3D model - Other - ADP02STR04-2
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ADP02STR04 Details

  • Manufacturer Part Number:

    ADP02STR04

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.50.70.00

  • Factory Lead Time:

    30 Weeks

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    7.3

  • Actuator Color:

    WHITE

  • Actuator Length:

    0.083 inch

  • Actuator Material:

    POLYAMIDE6T

  • Actuator Type:

    PIANO TYPE

  • Additional Feature:

    APPROVAL: UL

  • Body Breadth:

    7.06 mm

  • Body Color:

    BLACK

  • Body Height:

    6 mm

  • Body Length or Diameter:

    7.06 mm

  • Center Contact Material:

    COPPER ALLOY

  • Center Contact Plating:

    GOLD OVER NICKEL

  • Contact Current(AC)-Max:

    1 A

  • Contact Current(DC)-Max:

    0.1 A

  • Contact (DC) Max Rating R Load:

    0.1A@24VDC

  • Contact Resistance:

    0.05 mΩ

  • Contact Voltage(DC)-Max:

    24 V

  • Dielectric Withstand Volts:

    300VAC V

  • Electrical Life:

    1000 Cycle(s)

  • End Contact Material:

    COPPER ALLOY

  • End Contact Plating:

    GOLD OVER NICKEL

  • Housing Material:

    POLYPHENYLENE SULPHIDE

  • Insulation Resistance:

    100000000 Ω

  • Insulator Material:

    POLYPHENYLENE SULPHIDE

  • JESD-609 Code:

    e4

  • Mounting Feature:

    PANEL MOUNT

  • Number of Positions:

    2

  • Number of Switch Sections:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Packing Method:

    TR

  • Surface Mount:

    NO

  • Switch Function:

    SPST

  • Switch Type:

    PIANO DIP SWITCH

  • Terminal Finish:

    Gold Flash (Au)

  • Terminal Length:

    0.157 inch

  • Terminal Material:

    COPPER ALLOY

ADP02STR04 Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application note AN-1043, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal performance and reliability.
  • TE Connectivity recommends following the soldering and rework guidelines outlined in their application note AN-1036. This document provides detailed information on soldering temperatures, times, and techniques, as well as rework procedures to minimize damage to the component.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to note that the device's performance and reliability may degrade at extreme temperatures. It's recommended to consult with TE Connectivity's application engineers for specific guidance on operating temperature ranges for your particular application.
  • The ADP02STR04 is designed to meet the requirements of various industries, including automotive and industrial. However, it's crucial to consult with TE Connectivity's application engineers to determine the suitability of the device for your specific application, as vibration and shock testing may be required to ensure reliability.
  • TE Connectivity recommends following proper ESD handling and storage procedures to prevent damage to the device. This includes using ESD-safe workstations, wrist straps, and packaging materials, as well as storing the devices in ESD-safe containers.

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ADP02STR04 Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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