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ADP1196ACBZ-02-R7 - Analog Devices

Description: Analog Devices ADP1196ACBZ-02-R7, Hot Swap Controller, 1.8 V, 6-Pin, WLCSP

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PCB Footprints
ADP1196ACBZ-02-R7 - Analog Devices PCB footprint - BGA - BGA - [WLCSP](CB-6-2)
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3D Models
ADP1196ACBZ-02-R7 - Analog Devices  - 3D model - BGA - [WLCSP](CB-6-2)
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ADP1196ACBZ-02-R7 Details

  • Manufacturer Part Number:

    ADP1196ACBZ-02-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    1 X 1.50 MM, 0.50 MM PITCH, ROHS COMPLIANT, WLCSP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    CB-6-2

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Built-in Protections:

    OVER CURRENT; THERMAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.675 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    NMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    800 µs

  • Turn-on Time:

    10000 µs

  • Width:

    0.95 mm

ADP1196ACBZ-02-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 4-layer PCB with a solid ground plane and a thermal relief pattern can also help to dissipate heat efficiently.
  • To ensure the stability of the output voltage, it's essential to follow the recommended capacitor selection and placement guidelines, and to ensure that the input voltage is within the recommended range. Additionally, the output voltage can be stabilized by adding a capacitor in parallel with the output resistor.
  • The maximum input voltage that can be applied to the ADP1196ACBZ-02-R7 is 5.5V. Exceeding this voltage can cause damage to the device.
  • The output voltage of the ADP1196ACBZ-02-R7 can be calculated using the formula: Vout = (R1/R2) * (Vin - Vref), where R1 and R2 are the resistors in the feedback network, Vin is the input voltage, and Vref is the reference voltage.
  • The recommended input capacitor value is 1uF to 10uF, and the recommended type is a ceramic capacitor with an X5R or X7R dielectric. This helps to filter out noise and ensure stable operation.

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ADP1196ACBZ-02-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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