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ADP160ACBZ-2.5-R7 - Analog Devices

Description: CMOS Linear Regulators

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ADP160ACBZ-2.5-R7 - Analog Devices PCB footprint - Other - Other - BGA4C50P2X2_100X100X64
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ADP160ACBZ-2.5-R7 - Analog Devices  - 3D model - Other - BGA4C50P2X2_100X100X64
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ADP160ACBZ-2.5-R7 Details

  • Manufacturer Part Number:

    ADP160ACBZ-2.5-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    WLCSP-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    CB-4-1

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.195 V

  • Dropout Voltage1-Nom:

    0.105 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.2 V

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    0.965 mm

  • Line Regulation-Max:

    0.00625%

  • Load Regulation-Max:

    0.0375%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    2.5875 V

  • Output Voltage1-Min:

    2.4125 V

  • Output Voltage1-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.64 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3.5%

  • Width:

    0.965 mm

ADP160ACBZ-2.5-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP160ACBZ-2.5-R7 involves keeping the input and output traces separate, using a solid ground plane, and minimizing the distance between the device and the output capacitors. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, ensure that the output capacitors meet the recommended specifications, the input voltage is within the recommended range, and the device is operated within the recommended temperature range. Additionally, a minimum ESR of 10mΩ for the output capacitors is recommended.
  • The ADP160ACBZ-2.5-R7 can handle a maximum input voltage of 5.5V. Exceeding this voltage may damage the device.
  • The ADP160ACBZ-2.5-R7 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's performance and consider thermal management techniques in high-temperature applications.
  • The output voltage of the ADP160ACBZ-2.5-R7 can be calculated using the formula: VOUT = (VIN x (R1/R2)) + (VREF x (R1/(R1+R2))), where VIN is the input voltage, R1 and R2 are the feedback resistors, and VREF is the internal reference voltage.

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ADP160ACBZ-2.5-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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