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ADP172ACBZ-1.0-R7 - Analog Devices

Description: CMOS Linear Regulator

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ADP172ACBZ-1.0-R7 - Analog Devices PCB footprint - Other - Other - BGA4C50P2X2_102X95X64
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ADP172ACBZ-1.0-R7 - Analog Devices  - 3D model - Other - BGA4C50P2X2_102X95X64
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ADP172ACBZ-1.0-R7 Details

  • Manufacturer Part Number:

    ADP172ACBZ-1.0-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    WLCSP-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    CB-4-4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.05 V

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    4 V

  • Input Voltage-Max:

    3.6 V

  • Input Voltage-Min:

    1.6 V

  • JESD-30 Code:

    R-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    1.025 mm

  • Line Regulation-Max:

    0.00525%

  • Load Regulation-Max:

    0.015%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    1.015 V

  • Output Voltage1-Min:

    0.97 V

  • Output Voltage1-Nom:

    1 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.64 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    0.95 mm

ADP172ACBZ-1.0-R7 Frequently Asked Questions (FAQs)

  • The recommended input capacitor value is 1uF to 10uF, depending on the input voltage and output current requirements. A larger capacitor can help reduce input voltage ripple and improve output stability.
  • Ensure good thermal design and heat dissipation by providing adequate airflow, using a heat sink if necessary, and keeping the device away from heat sources. Monitor the device's junction temperature (TJ) to prevent overheating.
  • The maximum output current is 1A, but it's recommended to derate the output current based on the input voltage, output voltage, and ambient temperature to ensure reliable operation and prevent overheating.
  • Yes, the ADP172ACBZ-1.0-R7 is qualified for automotive and high-reliability applications, but additional testing and validation may be required to meet specific industry standards and requirements.
  • Follow good PCB design practices, such as separating analog and digital grounds, using a solid ground plane, and keeping noise-sensitive components away from the switching node. Consult the datasheet and application notes for specific layout recommendations.

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ADP172ACBZ-1.0-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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