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ADP2138ACBZ-3.0-R7 - Analog Devices

Description: Buck Switching Regulator IC Positive Fixed 3V 1 Output 800mA 6-UFBGA, WLCSP

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ADP2138ACBZ-3.0-R7 - Analog Devices PCB footprint - Other - Other - CB-6-12_2025-1
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ADP2138ACBZ-3.0-R7 - Analog Devices  - 3D model - Other - CB-6-12_2025-1
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ADP2138ACBZ-3.0-R7 Details

  • Manufacturer Part Number:

    ADP2138ACBZ-3.0-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    WLCSP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    CB-6-12

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.3 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.505 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.65 A

  • Output Voltage-Max:

    3.06 V

  • Output Voltage-Min:

    2.94 V

  • Output Voltage-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.64 mm

  • Supply Current-Max (Isup):

    0.03 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3400 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.03 mm

ADP2138ACBZ-3.0-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP2138 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor has a low ESR and is properly decoupled from the input capacitor. Additionally, a small ceramic capacitor (e.g., 10nF) can be added in parallel with the output capacitor to improve stability.
  • The maximum input voltage for the ADP2138 is 5.5V, but it's recommended to keep the input voltage below 5V to ensure reliable operation and to prevent damage to the device.
  • The ADP2138 is rated for operation up to 125°C, but its performance may degrade at high temperatures. It's recommended to derate the output current and ensure proper thermal management to prevent overheating.
  • The output voltage ripple of the ADP2138 can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.

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ADP2138ACBZ-3.0-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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