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ADP2311ACPZ-1-R7 - Analog Devices

Description: Conv DC-DC 4.5V to 18V Synchronous Step Down Dual-Out 0.6V to 18V 1A/1A 24-Pin LFCSP EP T/R

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PCB Footprints
ADP2311ACPZ-1-R7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-24-15
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3D Models
ADP2311ACPZ-1-R7 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-24-15
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ADP2311ACPZ-1-R7 Details

  • Manufacturer Part Number:

    ADP2311ACPZ-1-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    CP-24-15

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    350 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ADP2311ACPZ-1-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP2311ACPZ-1-R7 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the output capacitor should be chosen to ensure a minimum equivalent series resistance (ESR) of 0.1 ohms, and the input capacitor should be a low-ESR type with a value between 1uF to 10uF.
  • The ADP2311ACPZ-1-R7 is rated for operation from -40°C to +125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. It's essential to ensure that the device's junction temperature does not exceed 150°C.
  • Yes, the ADP2311ACPZ-1-R7 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive applications and is also suitable for industrial and medical applications that require high reliability.
  • To troubleshoot issues, start by verifying the input voltage, output voltage, and output current. Check for proper PCB layout, component values, and soldering quality. Use an oscilloscope to check for oscillations, noise, or other anomalies. If the issue persists, consult the datasheet and application notes or contact Analog Devices' technical support.

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ADP2311ACPZ-1-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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