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ADP2380AREZ-R7 - Analog Devices

Description: Conv DC-DC 4.5V to 20V Step Down Single-Out 0.6V to 18V 4A 16-Pin TSSOP EP T/R

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ADP2380AREZ-R7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RE-16-3
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ADP2380AREZ-R7 - Analog Devices  - 3D model - Small Outline Packages - RE-16-3
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ADP2380AREZ-R7 Details

  • Manufacturer Part Number:

    ADP2380AREZ-R7

  • Source Url Status Check Date:

    2013-05-01 14:56:46.032

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RE-16-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 0.6 V TO 18 V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    9 A

  • Output Voltage-Max:

    18 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1400 kHz

  • Technology:

    DMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ADP2380AREZ-R7 Frequently Asked Questions (FAQs)

  • It is recommended to follow the layout and placement guidelines provided in the ADP2380 datasheet, including keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI.
  • To optimize output voltage accuracy, ensure that the input voltage is within the recommended range, use a high-precision resistor divider network for the feedback resistors, and minimize noise and ripple on the input and output lines.
  • The ADP2380AREZ-R7 can deliver up to 2A of output current, but it is recommended to derate the output current based on the ambient temperature and the device's thermal performance to ensure reliable operation.
  • Use external overvoltage protection (OVP) and undervoltage lockout (UVLO) circuits to protect the device from voltage transients and faults. The ADP2380AREZ-R7 also has built-in UVLO and OVP features, but these may not be sufficient for all applications.
  • The ADP2380AREZ-R7 has a thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C. Ensure reliable operation by providing adequate heat sinking, using a thermally conductive PCB material, and minimizing power dissipation.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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