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ADP3333ARMZ-2.5-R7 - Analog Devices

Description: LDO Regulator 2.5V 0.6A 8-Pin MSOP

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ADP3333ARMZ-2.5-R7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RM-8 (MSOP)1
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ADP3333ARMZ-2.5-R7 - Analog Devices  - 3D model - Small Outline Packages - RM-8 (MSOP)1
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ADP3333ARMZ-2.5-R7 Details

  • Manufacturer Part Number:

    ADP3333ARMZ-2.5-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TSSOP

  • Package Description:

    ROHS COMPLIANT, ULTRA SMALL, MO-187A, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RM-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.23 V

  • Dropout Voltage1-Nom:

    0.14 V

  • Input Voltage Absolute-Max:

    16 V

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    2.6 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    2.545 V

  • Output Voltage1-Min:

    2.455 V

  • Output Voltage1-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    1.8%

  • Width:

    3 mm

ADP3333ARMZ-2.5-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP3333 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI.
  • To ensure stability, ensure that the output capacitor is within the recommended range, the input voltage is within the specified range, and the device is operated within the recommended temperature range. Also, avoid using long input traces and minimize the distance between the input capacitor and the device.
  • The ADP3333 can deliver up to 3A of output current, but this is dependent on the input voltage, output voltage, and ambient temperature. Refer to the datasheet for more information on output current capabilities.
  • The ADP3333 is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. Ensure that the device is operated within the recommended temperature range for optimal performance and reliability.
  • Use a TVS (transient voltage suppressor) diode or a voltage clamp circuit to protect the ADP3333 from input voltage transients and surges. This will help prevent damage to the device and ensure reliable operation.

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ADP3333ARMZ-2.5-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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