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ADP5070AREZ - Analog Devices

Description: Switching Voltage Regulators uPMU V+/V- sw reg for bipolarADC/DAC/AMP

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ADP5070AREZ - Analog Devices - PCB symbol
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ADP5070AREZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - ep(TSSOP)
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ADP5070AREZ - Analog Devices - 3D model - Small Outline Packages - ep(TSSOP)
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ADP5070AREZ Details

  • Manufacturer Part Number:

    ADP5070AREZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    RE-20-1

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    OPERATES IN ADJUSTABLE MODE UP TO 39V AND NEG VOLT DOWN TO -36.15V

  • Analog IC - Other Type:

    DUAL SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    15 V

  • Input Voltage-Min:

    2.85 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.2 A

  • Output Voltage-Max:

    39 V

  • Output Voltage-Nom:

    15 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    2560 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ADP5070AREZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP5070AREZ involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces connecting the input and output pins. Additionally, it's recommended to use a separate analog ground plane and to keep the power and ground traces separate.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. Also, avoid using long traces and minimize the inductance in the input and output lines.
  • The ADP5070AREZ can handle input voltages up to 15V, but it's recommended to keep the input voltage below 12V to ensure optimal performance and to prevent overheating.
  • The ADP5070AREZ is rated for operation up to 125°C, but it's recommended to derate the output current and input voltage at high temperatures to prevent overheating and ensure reliability.
  • To troubleshoot issues with the ADP5070AREZ, start by checking the input voltage, output voltage, and output current. Verify that the input and output capacitors are of high quality and have low ESR. Check the PCB layout for any noise or interference issues. Also, ensure that the device is properly soldered and that there are no cold solder joints.

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ADP5070AREZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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