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ADP5075ACBZ-R7 - Analog Devices

Description: Conv DC-DC 2.85V to 15V Inv Single-Out -0.5V to -36.15V 0.8A 12-Pin WLCSP T/R

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ADP5075ACBZ-R7 - Analog Devices PCB footprint - BGA - BGA - 3
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ADP5075ACBZ-R7 - Analog Devices  - 3D model - BGA - 3
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ADP5075ACBZ-R7 Details

  • Manufacturer Part Number:

    ADP5075ACBZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    CB-12-11

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    15 V

  • Input Voltage-Min:

    2.85 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PBGA-B12

  • JESD-609 Code:

    e1

  • Length:

    2.18 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.96 A

  • Output Voltage-Max:

    -39 V

  • Output Voltage-Min:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.66 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    INVERTER

  • Switching Frequency-Max:

    2560 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1.61 mm

ADP5075ACBZ-R7 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the device, and use short, wide traces for the power paths.
  • Use a thermal pad or thermal interface material to improve heat transfer between the device and the PCB. Ensure good airflow around the device, and consider using a heat sink or thermal management system for high-power applications.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10uF to 22uF is recommended. The capacitor should be placed close to the VIN pin and have a low inductance path to the device.
  • Use a high-precision voltage reference (e.g., ADR5120) and ensure that the output voltage is within the device's specified range. Also, minimize noise and ripple on the input voltage and ensure a stable input voltage.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10uF to 22uF is recommended. The capacitor should be placed close to the VOUT pin and have a low inductance path to the device.

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ADP5075ACBZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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