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ADP5310AREZN-2.8R7 - Analog Devices

Description: Voltage Regulators - Switching Regulators IC 2.8V VOUT2 ULP Buck PMU

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ADP5310AREZN-2.8R7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RE-16-2(TSSOP)
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ADP5310AREZN-2.8R7 - Analog Devices  - 3D model - Small Outline Packages - RE-16-2(TSSOP)
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ADP5310AREZN-2.8R7 Details

  • Manufacturer Part Number:

    ADP5310AREZN-2.8R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RE-16-2

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    15 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    6 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.45 A

  • Output Voltage-Max:

    2.842 V

  • Output Voltage-Min:

    2.758 V

  • Output Voltage-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1350 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ADP5310AREZN-2.8R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP5310 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, make sure to decouple the input and output with suitable capacitors, and consider adding a small series resistor (e.g., 1-10 ohms) between the output and the load to dampen oscillations.
  • The ADP5310 can deliver up to 3A of output current, but this is dependent on the input voltage, output voltage, and ambient temperature. It's essential to check the device's power dissipation and thermal management to ensure reliable operation.
  • The ADP5310 is rated for operation up to 125°C, but its performance and reliability may degrade at higher temperatures. It's crucial to consider the device's thermal management and power dissipation when operating in high-temperature environments.
  • The ADP5310's output voltage can be programmed using an external resistor divider network connected to the FB pin. The output voltage is determined by the ratio of the resistors and the internal reference voltage. Consult the datasheet for specific equations and examples.

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ADP5310AREZN-2.8R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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