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ADP7142ACPZN2.5-R7 - Analog Devices

Description: 40 V, 200 mA, Low Noise, CMOS LDO Linear Regulator

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ADP7142ACPZN2.5-R7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 6-Lead Lead Frame Chip Scale Package [LFCSP] 2.00 mm × 2.00 mm Body and 0.55 mm Package Height (CP-6-3)
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ADP7142ACPZN2.5-R7 - Analog Devices  - 3D model - Small Outline No-lead - 6-Lead Lead Frame Chip Scale Package [LFCSP] 2.00 mm × 2.00 mm Body and 0.55 mm Package Height (CP-6-3)
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ADP7142ACPZN2.5-R7 Details

  • Manufacturer Part Number:

    ADP7142ACPZN2.5-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    CP-6-3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Dropout Voltage1-Max:

    0.42 V

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    2.7 V

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    2.545 V

  • Output Voltage1-Min:

    2.455 V

  • Output Voltage1-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    1.8%

  • Width:

    2 mm

ADP7142ACPZN2.5-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP7142 involves keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the input traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability in high-gain configurations, it's essential to follow the recommended compensation network and component values, and to ensure that the output capacitor is properly sized. Additionally, it's recommended to add a small capacitor (e.g., 10nF) in parallel with the output resistor to improve stability.
  • The ADP7142 can deliver up to 2A of output current, but this is dependent on the input voltage, output voltage, and thermal conditions. It's essential to ensure that the device is properly heatsinked and that the input voltage is sufficient to support the required output current.
  • To protect the ADP7142 from input voltage transients and surges, it's recommended to use a TVS (transient voltage suppressor) diode or a voltage clamp circuit at the input. Additionally, a fuse or a current limiter can be used to protect against overcurrent conditions.
  • The recommended input capacitor value for the ADP7142 is 10uF to 22uF, with a voltage rating that matches the input voltage. A larger capacitor value can be used, but it may affect the startup time and stability of the device.

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ADP7142ACPZN2.5-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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