A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and coupling.
Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) as close as possible to the VIN pin. Add additional decoupling capacitors (e.g., 100nF ceramic) near the VOUT pin. Ensure the power supply is stable and has low ripple.
The ADP7002C-KIT can deliver up to 2A of output current, but this may vary depending on the input voltage, output voltage, and thermal conditions. Consult the datasheet for specific current limits.
The output voltage can be adjusted by changing the resistor values of the feedback network (R1 and R2). Use the formula in the datasheet to calculate the required resistor values for the desired output voltage.
Ensure good airflow around the device. Use a heat sink or thermal pad on the exposed pad of the QFN package to improve thermal dissipation. Keep the device away from other heat sources.
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ADPA7002C-KIT Overview
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