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ADSP-21060LABZ-160 - Analog Devices

Description: Digital Signal Processors & Controllers - DSP, DSC 40MHz 120 MFLOPS 5V Floating Point

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ADSP-21060LABZ-160 - Analog Devices PCB footprint - BGA - BGA - 225-BGA-(B-225-2)
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ADSP-21060LABZ-160 - Analog Devices  - 3D model - BGA - 225-BGA-(B-225-2)
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ADSP-21060LABZ-160 Details

  • Manufacturer Part Number:

    ADSP-21060LABZ-160

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    ROHS COMPLIANT, PLASTIC, MS-034AAJ-2, BGA-225

  • Pin Count:

    225

  • Manufacturer Package Code:

    B-225-2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Address Bus Width:

    32

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    40 MHz

  • External Data Bus Width:

    48

  • Format:

    FLOATING POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B225

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    225

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA225,15X15,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    4194304

  • Seated Height-Max:

    2.7 mm

  • Supply Voltage-Max:

    3.45 V

  • Supply Voltage-Min:

    3.15 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-21060LABZ-160 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDDSP and VDDIO. This ensures proper power-up and minimizes the risk of latch-up or other damage.
  • To optimize performance, consider the following: use the highest possible clock frequency, minimize memory accesses, use the cache effectively, and optimize code using the compiler's optimization options. Additionally, consider using the processor's built-in accelerators and peripherals to offload tasks.
  • The DMA controller has limitations on the number of channels, transfer sizes, and burst lengths. It's essential to carefully plan and configure the DMA transfers to avoid conflicts and ensure efficient data transfer.
  • To ensure reliable data transfer, use the processor's built-in peripherals (e.g., UART, SPI, I2C) and follow the recommended interface protocols. Additionally, implement error detection and correction mechanisms, such as checksums or CRCs, to detect and correct data transmission errors.
  • The ADSP-21060LABZ-160 has a maximum junction temperature of 150°C. Ensure proper heat dissipation by using a heat sink, thermal interface material, and a well-designed PCB layout. Monitor the device's temperature using the on-chip temperature sensor and implement thermal throttling or shutdown mechanisms to prevent overheating.

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ADSP-21060LABZ-160 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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