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ADSP-21060LCW-160 - Analog Devices

Description: BGA 225

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ADSP-21060LCW-160 - Analog Devices PCB footprint - BGA - BGA - 225-BGA-(B-225-2)
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ADSP-21060LCW-160 - Analog Devices  - 3D model - BGA - 225-BGA-(B-225-2)
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ADSP-21060LCW-160 Details

  • Manufacturer Part Number:

    ADSP-21060LCW-160

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    THERMALLY ENHANCED, METRIC, HEAT SINK, CERAMIC, QFP-240

  • Pin Count:

    240

  • Manufacturer Package Code:

    QS-240-1A

  • Country Of Origin:

    USA

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Address Bus Width:

    32

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    40 MHz

  • External Data Bus Width:

    48

  • Format:

    FLOATING POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-CQFP-G240

  • JESD-609 Code:

    e4

  • Length:

    32 mm

  • Low Power Mode:

    YES

  • Number of Terminals:

    240

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    HFQFP

  • Package Equivalence Code:

    HQFP240,1.37SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, FINE PITCH

  • Qualification Status:

    Not Qualified

  • RAM (words):

    131072

  • Seated Height-Max:

    4.2 mm

  • Supply Current-Max:

    600 mA

  • Supply Voltage-Max:

    3.45 V

  • Supply Voltage-Min:

    3.15 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    32 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-21060LCW-160 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD (core voltage) first, followed by VIO (I/O voltage) and then the clock signal. This ensures proper device initialization and prevents latch-up.
  • The ADSP-21060LCW-160 has a flexible memory architecture. To optimize memory configuration, consider the specific requirements of your application, such as data and program memory needs, and configure the memory accordingly using the device's memory control registers.
  • The ADSP-21060LCW-160 is a high-performance processor that can generate significant heat. Ensure proper thermal management by providing adequate heat sinking, using thermal interface materials, and following recommended PCB design guidelines to prevent overheating.
  • The ADSP-21060LCW-160 has various low-power modes, including idle, sleep, and shutdown modes. Implement these modes by configuring the device's power management registers and using the device's built-in power management features to reduce power consumption.
  • To minimize EMI and ensure EMC, follow proper PCB design guidelines, use shielding and filtering techniques, and ensure that the device is properly grounded. Additionally, consider using EMI-reducing components and following regulatory guidelines for EMI and EMC compliance.

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ADSP-21060LCW-160 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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