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ADSP-21061LKBZ-160 - Analog Devices

Description: Digital Signal Processors & Controllers - DSP, DSC 50MHz 150 MFLOPS 5V Floating Point

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PCB Footprints
ADSP-21061LKBZ-160 - Analog Devices PCB footprint - BGA - BGA - 225-Ball Plastic Ball Grid Array [PBGA] (B-225-2)
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ADSP-21061LKBZ-160 - Analog Devices  - 3D model - BGA - 225-Ball Plastic Ball Grid Array [PBGA] (B-225-2)
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ADSP-21061LKBZ-160 Details

  • Manufacturer Part Number:

    ADSP-21061LKBZ-160

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    ROHS COMPLIANT, PLASTIC, BGA-225

  • Pin Count:

    225

  • Manufacturer Package Code:

    B-225-2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Address Bus Width:

    32

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    40 MHz

  • External Data Bus Width:

    48

  • Format:

    FLOATING POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B225

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    225

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    PGA225,15X15

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    32768

  • Seated Height-Max:

    2.57 mm

  • Supply Current-Max:

    480 mA

  • Supply Voltage-Max:

    3.45 V

  • Supply Voltage-Min:

    3.15 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-21061LKBZ-160 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDDSP and VDDIO. This ensures proper device operation and prevents latch-up.
  • Optimizing performance involves understanding the device's pipeline architecture, using the cache effectively, and optimizing code using the compiler's optimization flags. Additionally, using the device's DMA controller and configuring the system clocks appropriately can also improve performance.
  • The JTAG interface has a maximum clock frequency of 10 MHz, and it is recommended to use a JTAG adapter that supports adaptive clocking to ensure reliable operation. Additionally, the JTAG interface is only available when the device is in debug mode.
  • To ensure reliable data transfer, it is essential to follow the device's timing specifications, use the correct clock frequencies, and implement proper handshaking mechanisms. Additionally, using the device's DMA controller can help reduce the processor's workload and improve data transfer reliability.
  • The device has a maximum junction temperature of 150°C. To ensure reliable operation, it is essential to provide adequate heat sinking, use thermal interface materials, and follow proper PCB design guidelines to minimize thermal resistance.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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