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ADSP-21369KSWZ-1A - Analog Devices

Description: ANALOG DEVICES - ADSP-21369KSWZ-1A - DSP, Floating Point, 32 / 40bit, 266 MHz, HLQFP, 208 Pins

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ADSP-21369KSWZ-1A - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - ADSP-21371BSWZ-2B
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ADSP-21369KSWZ-1A - Analog Devices  - 3D model - Quad Flat Packages - ADSP-21371BSWZ-2B
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ADSP-21369KSWZ-1A Details

  • Manufacturer Part Number:

    ADSP-21369KSWZ-1A

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-208

  • Pin Count:

    208

  • Manufacturer Package Code:

    SW-208-1

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Address Bus Width:

    24

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    44.44 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e3

  • Length:

    28 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    65536

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    28 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-21369KSWZ-1A Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC first, followed by VDDDSP and VDDIO. This ensures that the internal voltage regulators are powered up before the DSP core and I/Os.
  • To optimize performance, consider the following: use the highest possible clock frequency, optimize code for the DSP's pipeline architecture, use cache and DMA efficiently, and minimize memory accesses. Additionally, use the VisualDSP++ development environment to analyze and optimize code performance.
  • The ADSP-21369KSWZ-1A has a maximum junction temperature of 125°C. Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking airflow to the device. Also, consider using thermal interface materials to improve heat transfer.
  • To ensure EMC, follow proper PCB design practices, use shielding and grounding techniques, and minimize noise radiation. Also, ensure that the device is operated within its specified frequency range and that clock frequencies are not harmonically related to other system frequencies.
  • In harsh environments, consider the device's operating temperature range, humidity, and vibration tolerance. Ensure that the device is properly packaged and sealed, and that the PCB is designed to withstand environmental stresses.

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ADSP-21369KSWZ-1A Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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