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ADSP-21562BSWZ4 - Analog Devices

Description: 400MHz SHARC+ DSP with 640KB L1, 256KB Shared L2 SRAM, 120-lead LQFP_EP

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ADSP-21562BSWZ4 - Analog Devices - PCB symbol
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PCB Footprints
ADSP-21562BSWZ4 - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP 1.4 MM W/ THERMAL PAD_2023-3
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3D Models
ADSP-21562BSWZ4 - Analog Devices - 3D model - Quad Flat Packages - LQFP 1.4 MM W/ THERMAL PAD_2023-3
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ADSP-21562BSWZ4 Details

  • Manufacturer Part Number:

    ADSP-21562BSWZ4

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-120

  • Pin Count:

    120

  • Manufacturer Package Code:

    SW-120-4

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Address Bus Width:

    16

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    500 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G120

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    120

  • Number of Timers:

    6

  • On Chip Data RAM Width:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP120,.63SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • RAM (words):

    163840

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-21562BSWZ4 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to power up the core voltage (VDDINT) first, followed by the I/O voltage (VDDIO), and then the PLL voltage (VDDPLL). This ensures proper device operation and prevents latch-up.
  • To optimize performance, consider factors such as clock frequency, cache usage, and memory access patterns. Use the ADSP-21562BSWZ's built-in performance counters and profiling tools to identify bottlenecks and optimize your code accordingly.
  • The ADSP-21562BSWZ is rated for operation from -40°C to 85°C (industrial temperature range). However, it's essential to ensure proper thermal management and heat dissipation to prevent overheating and ensure reliable operation.
  • The ADSP-21562BSWZ is not specifically designed for radiation-hardened or high-reliability applications. However, Analog Devices offers other products that are designed for such applications. Consult with Analog Devices' sales team or application engineers to determine the best solution for your specific requirements.
  • Follow Analog Devices' recommended PCB layout guidelines, including proper decoupling, signal routing, and power plane design. Ensure that the PCB design meets the device's thermal and electrical requirements to prevent signal integrity issues and ensure reliable operation.

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ADSP-21562BSWZ4 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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