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ADSP-21563KSWZ8 - Analog Devices

Description: Up to 800MHz SHARC+ DSP with 640KB L1, 512KB Shared L2 SRAM, 120-lead LQFP_EP

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PCB Footprints
ADSP-21563KSWZ8 - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP 1.4 MM W/ THERMAL PAD_2023
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3D Models
ADSP-21563KSWZ8 - Analog Devices  - 3D model - Quad Flat Packages - LQFP 1.4 MM W/ THERMAL PAD_2023
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ADSP-21563KSWZ8 Details

  • Manufacturer Part Number:

    ADSP-21563KSWZ8

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-120

  • Pin Count:

    120

  • Manufacturer Package Code:

    SW-120-4

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Address Bus Width:

    16

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    500 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G120

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    120

  • Number of Timers:

    6

  • On Chip Data RAM Width:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP120,.63SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (words):

    163840

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-21563KSWZ8 Frequently Asked Questions (FAQs)

  • Analog Devices provides a recommended PCB layout and thermal management guide in the ADSP-21563KSWZ8 Hardware Reference Manual. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • Analog Devices provides a power estimation tool and guidelines in the ADSP-21563KSWZ8 datasheet and hardware reference manual. Additionally, optimizing clock frequencies, using power-saving modes, and minimizing peripheral usage can help reduce power consumption.
  • Use the VisualDSP++ development environment and its built-in debugging tools, such as the debugger and logic analyzer. Also, implement robust error handling and logging mechanisms in your code to facilitate troubleshooting.
  • Follow the guidelines in the ADSP-21563KSWZ8 datasheet and hardware reference manual for PCB layout, shielding, and filtering. Additionally, perform EMC and EMI testing to ensure compliance with relevant standards and regulations.
  • The ADSP-21563KSWZ8 is rated for operation up to 125°C. However, high temperatures can affect performance, power consumption, and reliability. Ensure proper thermal management, and consider derating the device's performance and power consumption at high temperatures.

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ADSP-21563KSWZ8 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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