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ADSP-21569KBCZ10 - Analog Devices

Description: Digital Signal Processors & Controllers - DSP, DSC DSP,DSC 1000MHz SHARC W DDR

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Symbol
ADSP-21569KBCZ10 - Analog Devices - PCB symbol
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PCB Footprints
ADSP-21569KBCZ10 - Analog Devices PCB footprint - BGA - BGA - (BC-400-3) -2
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3D Models
ADSP-21569KBCZ10 - Analog Devices - 3D model - BGA - (BC-400-3) -2
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ADSP-21569KBCZ10 Details

  • Manufacturer Part Number:

    ADSP-21569KBCZ10

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-400

  • Pin Count:

    400

  • Manufacturer Package Code:

    BC-400-3

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Address Bus Width:

    16

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    500 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B400

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    400

  • Number of Timers:

    10

  • On Chip Data RAM Width:

    32

  • Operating Temperature-Max:

    110 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA400,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (words):

    163840

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.38 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-21569KBCZ10 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDDDR. This ensures proper power-up and minimizes the risk of latch-up or other damage.
  • Optimizing performance requires understanding the application's requirements and configuring the processor accordingly. This includes setting the clock frequency, configuring the cache, and optimizing the memory hierarchy. Consult the ADSP-21569KBCZ10's software development kit (SDK) and application notes for guidance.
  • The ADSP-21569KBCZ10 has a maximum junction temperature of 125°C. Ensure proper heat dissipation by using a heat sink, thermal interface material, and a well-designed PCB. Consult the datasheet and thermal management application notes for more information.
  • To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering as needed. Consult the ADSP-21569KBCZ10's EMC application notes and relevant industry standards (e.g., IEC 61000-4-2) for guidance.
  • The ADSP-21569KBCZ10 is rated for industrial temperature range (-40°C to 85°C). For harsh environments, consider using conformal coating, potting, or hermetic packaging to protect the device. Consult the datasheet and relevant industry standards (e.g., IEC 60068-2-14) for guidance.

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ADSP-21569KBCZ10 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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