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ADSP-21593BBPZ10 - Analog Devices

Description: Up to 1GHz Dual-SHARC+? DSP with 2x 640KB L1, 2048KB Shared L2 SRAM, 400-Ball FCBGA

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ADSP-21593BBPZ10 - Analog Devices PCB footprint - BGA - BGA - BP-400-3
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ADSP-21593BBPZ10 - Analog Devices  - 3D model - BGA - BP-400-3
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ADSP-21593BBPZ10 Details

  • Manufacturer Part Number:

    ADSP-21593BBPZ10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-400

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Barrel Shifter:

    YES

  • Bit Size:

    64

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    1000 MHz

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B400

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Number of Serial I/Os:

    6

  • Number of Terminals:

    400

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA400,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (words):

    2097152

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1933 mA

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, MIXED

ADSP-21593BBPZ10 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC first, followed by VDDDSP and VDDIO. This ensures that the internal voltage regulators are powered up correctly.
  • Optimizing performance requires understanding the application's requirements and configuring the processor accordingly. This includes setting the clock frequency, cache settings, and optimizing code for the specific use case. Analog Devices provides tools and documentation to help with this process.
  • The maximum operating temperature range for the ADSP-21593BBPZ10 is -40°C to 105°C. However, it's essential to ensure that the device is properly cooled to maintain reliability and performance.
  • The ADSP-21593BBPZ10 provides built-in error correction and detection mechanisms, such as ECC and parity bits, for its memory interfaces. Implementing these mechanisms requires configuring the processor's memory controllers and using the provided software libraries.
  • The limitations of the ADSP-21593BBPZ10's peripherals are documented in the datasheet and user manual. For example, the UART interface has a maximum baud rate of 12.5 Mbps, and the SPI interface has a maximum clock frequency of 50 MHz. Understanding these limitations is essential for designing a reliable and efficient system.

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ADSP-21593BBPZ10 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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